Negative thermal expansion / Zero thermal expansion / Low thermal expansion filler BNFO
Canceling the thermal expansion of resin! A material developed in academia that solves dimensional deviations, warping, and characteristic changes in precision assembly products.
"BNFO (Bismuth-Nickel-Iron Oxide)" is a perovskite-type oxide material that exhibits an enormous negative linear thermal expansion of minus 187 per million for each degree of temperature increase. 【Technical Overview and Features】 It is a filler that suppresses the thermal expansion of components when compounded with resin. It has a significant thermal expansion suppression effect and allows for flexible control of the operating temperature range. It possesses negative thermal expansion characteristics that are 4 to 5 times greater than those of commercially available products from other companies. 【Applications of the Product and Technology】 It can be applied to adhesives for precision parts and injection molding. It is compounded and molded with epoxy, acrylic, silicone, and engineering plastics, and numerous expansion suppression effects have been confirmed. 【Benefits for Users】 It is expected to support high-density integration, expand the processing temperature range, improve dimensional accuracy, stabilize high-temperature characteristics, reduce warping, and enhance adhesion and flexibility by reducing the amount of filler used. *For more details, please refer to the PDF document or feel free to contact us.
- Company：日本材料技研
- Price：Other
